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Texas Instruments Incorporated (TI) is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology today and building solutions for tomorrow. With more than 15 years of wireless experience as a proven semiconductor partner, TI is extending its proven 2G and 2.5G technology into the growing 3G market and has established an early lead in supplying true 3G capabilities worldwide. In addition, TI is accelerating the mobile connectivity revolution in handsets by providing multiple non-cellular wireless connectivity technologies to allow seamless communication with any device over any network, anywhere, anytime.

TI believes that cutting-edge mobile entertainment applications will propel 3G to become a high-volume, high-revenue market. TI’s wireless portfolio is already delivering compelling, high-performance mobile entertainment and multimedia features for the market via its widely adopted OMAP™ processors. In fact, TI’s OMAP processors are powering the majority of 3G FOMA handsets, delivering mobile entertainment capabilities to the world's largest 3G network in the rapidly growing Japanese market, a market which is already pushing the envelope for wireless applications and services. TI’s OMAP 2 architecture is redefining mobile entertainment and will be the first to deliver a quality consumer electronics user experience to the mobile handset, such as digital TV, hi-fi music with 3D effects, up to DVD-quality video, high-end gaming console functionality, best-in-class color display, and digital cameras with up to 6 megapixels.

As the 3G market evolves, the cell phone will be transformed from a trendy device to a “must have” personal communication, information, entertainment and productivity device. With the emergence of high-performance technologies for imaging, audio and graphics, mobile entertainment is expected to be a key driver for wireless services revenue. Over the past several years, TI has been providing both 3G WCDMA (UMTS) modems and OMAP processors to industry leading 3G handset companies worldwide, including companies in Europe, Japan and Korea. TI believes that the combination of these technologies will become increasingly important in the years ahead, as demonstrated by TI’s collaboration with NTT DoCoMo to deliver an integrated UMTS digital baseband and application processor, based on TI’s OMAP 2 architecture to the worldwide 3G handset market.

TI’s focus is on real-time communications, and its proven wireless technology is delivering the high-performance and low-power consumption required by today’s more complex wireless applications.